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JPMorgan secures general lead underwriting license in China

By Jiang Xueqing | chinadaily.com.cn | Updated: 2026-01-07 20:40

This file photo taken on Oct 8, 2024 shows the Shenzhen Stock Exchange in Shenzhen, South China's Guangdong province. [Photo/Xinhua]

JPMorgan Chase Bank (China) Company Limited announced on Wednesday that it has recently received the general lead underwriting license for non-financial enterprise debt financing instruments, granted by the National Association of Financial Market Institutional Investors. JPMorgan said the approval marks a new breakthrough in the development of its bond business in China.

"Obtaining the general lead underwriting license will further broaden and deepen our services for both onshore and offshore issuers and investors," said Celine Xiong, president of JPMorgan Chase Bank (China) Company Limited. "It will enable us to better leverage the dual strengths of our global resources and local expertise to serve clients, continue to help promote the internationalization and inclusiveness of China's capital markets, and enhance the pricing influence and resource allocation efficiency of China's capital markets within the global financial system."

In recent years, China's bond market has continued to expand, achieving a dual leap in both scale and quality. As of the end of November 2025, foreign institutions held 3.61 trillion yuan ($516.24 billion) in bonds within the China interbank bond market, with 1,187 overseas institutions participating, underscoring the growing importance of China's bond market as an important destination for global capital.

JPMorgan noted that it is well positioned to serve as a connector between onshore and offshore markets. On one hand, the firm provides diversified and internationalized bond financing solutions for Chinese companies to support the real economy. On the other hand, it helps global investors to navigate and engage with China's bond market, optimizing the investor structure and further raising the market's internationalization.

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